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Valeo Group | 9 Jun, 2026
| 5 min
Valeo and Calyos Revolutionize Thermal Management of Chips Used for Data Centers and Mobility with Advanced Passive Two-Phase Cooling Solutions
- Valeo and Calyos have signed a Memorandum of Understanding (MoU) to develop and industrialize high-performance, standalone chip cooling solutions.
- The technology addresses increasing thermal challenges in both Mobility (electrification, Software Defined Vehicle) and Data Center market.
- The new passive advanced two-phase cooling systems combine the partners’ expertise for more efficient, compact, maintenance-free, and highly reliable solutions.
- This new technology is a perfect add-on to Valeo’s existing portfolio of thermal management solutions for data centers and vehicle power electronics.
9 June 2026 — Paris (France) — Valeo, a world leader in automotive technology, and Calyos, a pioneer in passive advanced two-phase Loop Heat Pipe (LHP) cooling solutions, announce the signing of a Memorandum of Understanding (MoU). It aims to develop and industrialize high-performance, standalone chip cooling solutions for the mobility and computing sectors, addressing the increasing thermal challenges posed by electrification and Artificial Intelligence (AI).
Pascale Herman, Christophe Delhovren, Antoine de Ryckel, Olivier de Laet
By combining Calyos’ expertise in Loop Heat Pipe technology with Valeo’s world-class thermal systems engineering, industrial scale, and global footprint, the two companies are set to deliver a new generation of passive advanced two-phase cooling systems that are more efficient – managing high heat flux – are more compact and easy to integrate, are maintenance-free, and highly reliable.
Addressing the future of mobility
As the scale of automotive electrification continues to grow, together with Software-Defined Vehicles (SDV), the computing power and heat generated by power electronics are increasing exponentially.
The Valeo-Calyos passive two-phase cooling solution provides benefits for:
- Power electronics: autonomous cooling for On-Board Chargers (OBC), inverters and “x-in-1” integrated power electronics, offering a compact, standalone – “plug-and-play” cooling system. For electronics located on the back side of the car, this solution offers energy saving and simplification of the vehicle cooling architecture.
- Software Defined Vehicles: SDV architecture is driving centralization of computing controllers with high power density requirements. Our solution provides optimized standalone, compact and reliable heat dissipation for the high-speed processors, ensuring reliability and easy to integrate cooling without the complexity of traditional distributed vehicle liquid cooling loops.
Valeo controller with 2-Phase passive cooling system
Revolutionizing Data Center Cooling Efficiency & AI Scalability
Valeo is applying decades of expertise in automotive thermal management to the data center industry, offering a comprehensive and scalable ecosystem of cooling solutions.
The collaboration targets the rapidly growing data center market, extending beyond the mobility sector. AI acceleration is driving data centers’ rack and chip power rise and Direct to Chip liquid cooling demand with an urgent need for better cooling efficiency to reduce global energy consumption (Power Usage Effectiveness reduction).
One of our first joint solution, a smart two-phase passive chip cooling solution for data center, offers:
- Energy efficiency thanks to two-Phase loop heat pipe effect, addressing higher processor power and heat flux requirements, and operating without active parts like pump;
- Ease of retrofit for air cooled server: standalone two-Phase loop heat pipe air cooled unit for each individual server within a rack, allowing data centers to upgrade power density with direct to chip cooling, without overhauling their entire facility infrastructure;
- Reliability & compactness: a passive, highly efficient two-Phase cooling system that simplifies maintenance (no active fluid pump) and reduces the risks of leaks compared to traditional water-cooling methods (lower dielectric fluid pressure).
Xavier DUPONT, Valeo Power Division Chief Executive Officer, stated: “This cooperation with Calyos is a new step in our mission to lead the thermal management revolution. By integrating Calyo’ s Loop Heat Pipe expertise into Valeo’s industrial ecosystem, we provide our customers in both the automotive and data center sectors with a unique cooling solution that is easy to integrate and scale, while significantly enhancing energy efficiency to support a more sustainable future. This new technology is a perfect add-on to our existing portfolio of thermal management solutions for data centers and vehicle power electronics.”
Antoine DE RYCKEL, CALYOS Chief Executive Officer, and Olivier DE LAET, CALYOS founder added: “Partnering with Valeo allows us to take our technology from a specialized innovation to a global industrial standard. Valeo’s manufacturing prowess and thermal expertise are the perfect catalysts to meet the cooling demands of the AI era and the next generation of electric vehicles.”
A Global Industrial Major Player
Through this agreement, Calyos’ innovative technology will benefit from Valeo’s industrial excellence. Valeo will ensure top-level system reliability and high-volume production capacity. With a “local-for-local” manufacturing strategy, Valeo will be able to produce these advanced cooling systems, offering sovereign capabilities worldwide.
This new technology serves as a smart add-on to our existing data center liquid cooling portfolio of solutions, complementing our current offerings in rear door aluminum heat exchanger cooling module (RDHx), one- and two-phase cooling distribution units (CDUs), and immersive cooling for edge data centers.
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